|
 |
|
| 制造一厂 |
| Package |
Die Mount Method |
Die Size (X*Y)MAX |
Die Thickness |
Al Wire |
Au Wire |
Wafer Size |
| T0-220 |
Soft Solder/Eutectic /Epoxy |
230mils*180mils |
8mils to 17mils |
5 to 20mils |
1.0mil-2.0mil |
8 inches max |
|
| 制造二厂 |
| Package |
Die Mount Method |
Max Die Size (X*Y) |
Die Thickness |
Al Wire |
Au Wire |
Wafer Size |
| T0-220 |
Soft Solder |
230mils*180mils |
8mils to 17mils |
5 to 20mils |
N/A |
8 inches max |
|
| |
|
| |
|
| Packages |
No1. Factory |
No.2 Factory |
| SOT-23 |
2KK/Week |
N/A |
|
